Thermal resistance

Results: 228



#Item
51Electromagnetism / Electronics manufacturing / Heat sink / Passive fire protection / Resistor / Thermal resistance / Surface-mount technology / Light-emitting diode / Temperature / Heat transfer / Electrical engineering / Physics

LM34 Precision Fahrenheit Temperature Sensors

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Source URL: www.singlechips.com

Language: English - Date: 2012-06-15 14:34:08
52Physics / Heat conduction / Physical quantities / Thermodynamics / Passive fire protection / Heat sink / Thermal resistance / Thermal management of electronic devices and systems / Thermal grease / Heat transfer / Mechanical engineering / Chemical engineering

Mini-Zenigata LEDs LED Lighting Application Note Thermal Management for Sharp’s Mini-Zenigata LED Modules Brian Witzen, Sharp Microelectronics of the Americas

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Source URL: www.sharpleds.com

Language: English - Date: 2010-10-20 16:03:08
53Insulators / Thermal protection / Building insulation materials / Thermal insulation / R-value / Duct / Building insulation / Mineral wool / Structural steel / Mechanical engineering / Chemical engineering / Heat transfer

Introduction Bradford Fibretex HD is a high density industrial insulation for use in applications where high compressive resistance is required. It is a heavy duty thermal and acoustic insulation suitable for continuous

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Source URL: www.owencorp.com

Language: English - Date: 2012-05-23 00:19:37
54Heat conduction / Thermal conductivity / Thermal resistance / R-value / Convective heat transfer / Heat exchanger / Thermal conduction / Waste heat recovery unit / Heat sink / Heat transfer / Mechanical engineering / Chemical engineering

DEVELOPMENT AND VALIDATION OF A VERSATILE METHOD FOR THE CALCULATION OF HEAT TRANSFER IN WATER-BASED RADIANT SYSTEMSq

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Source URL: www.sbi.dk

Language: English - Date: 2012-11-14 17:41:18
55Chemistry / Heat conduction / Physical quantities / Thermal conduction / Thermal conductivity / R-value / Thermal resistance / Heat equation / Temperature / Heat transfer / Mechanical engineering / Chemical engineering

ME6301 – Conductive Heat Transfer: Numerical Conduction Project Submitted by: Nathan Rolander

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Source URL: www.srl.gatech.edu

Language: English - Date: 2004-12-14 14:31:17
56High electron mobility transistor / Diamond-like carbon / Transistor / Gallium nitride / Aluminium gallium nitride / Titanium nitride / Semiconductor / Silicon carbide / Chemistry / Nitrides / Superhard materials

88 Technology focus: GaN HEMTs Diamond-like carbon used to improve performance of GaN HEMTs Diamond-like carbon and micro-machining reduces thermal resistance

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Source URL: www.semiconductor-today.com

Language: English - Date: 2015-04-08 17:14:59
57Insulators / Thermal protection / Building engineering / Energy conservation / R-value / Wire / Thermal insulation / Thermal resistance / Label / Mechanical engineering / Heat transfer / Chemical engineering

HYDRONIC SYSTEM INSULATION TECHNOLOGY New innovative product from Beaver Plastics Ltd. • Multi-directional grid design

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Source URL: www.beaverplastics.com

Language: English
58Eurocard / CompactPCI / Thermal resistance / Thermal management of electronic devices and systems / Backplane / Evaluation / Reference / Computer buses / VPX / Electronics

3U Sealed Four Heat Exchanger 3U atr Enclosure »» »» »» »»

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Source URL: www.cmcomputer.com

Language: English - Date: 2014-07-11 07:35:08
59Heat conduction / Chemistry / Passive fire protection / Heat sink / Thermal conductivity / Heat exchanger / Thermal resistance / Measuring instrument / Thermal management of electronic devices and systems / Heat transfer / Mechanical engineering / Chemical engineering

Comparing FEA Models for Finned Passive Heat Exchangers The following summary compares three different FEA model thermal analysis results with a "standard" prediction, including comments on the time required to create ea

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Source URL: lisafea.com

Language: English - Date: 2013-01-11 13:53:59
60Semiconductors / Passive fire protection / Semiconductor devices / Electronic design / Thermal resistance / Junction temperature / Heat sink / Thermal management of electronic devices and systems / Derating / Electronics / Electronic engineering / Technology

National Semiconductor Application Note 336 Charles Carinalli Josip Huljev March 1983

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Source URL: cdn.preterhuman.net

Language: English - Date: 2012-10-01 16:12:25
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